Solder Paste Inspection System
NVI-S300 is a solder paste inspection system (SPI) with laser optical cutting method. In addition to its high repeatability and resistance to influence by the ambient environment, the 3D+2D no-blind-spot inspection ensures to detect any defects and provides reliable inspection results at high speed.
Features
NVI-S300 uses a laser measurement method that excels in absolute measurement accuracy, and the introduction of the NVI-S300 will help improve the quality of your products and appeal to your clients as "proof of reliable print solder inspection".
NVI-S300 also serves as an inspection device to stop the flow of defective substrates to subsequent processes, while at the same time making it possible to numerically manage and easily analyze printing defect trends. By utilizing this information, it is possible to construct production lines with higher yields.
Fast and accurate reproduction of object shape
The combination of 3D and 2D images enables accurate detection of any defects. 2D images can be used to stably detect defective bridging or near-bridging conditions that occur below the 3D reference plane, as well as spilled solder.
Accurately detects any defects
The combination of 3D and 2D images enables accurate detection of any defects. 2D images can be used to stably detect defective bridging or near-bridging conditions that occur below the 3D reference plane, as well as spilled solder.
Also, foreign objects such as fiber waste, solder balls, hair, etc. that occur outside of the solder print area can be detected stably.
Compatible with flexible circuit boards that are easily warped
The imaging mechanism has a wide focal range of +/-1.5 mm in the height direction to acquire blur-free 2D images. Z-axis control of the optical system is possible, and the system can follow a board warp of up to +/-5 mm. Furthermore, our unique algorithm enables accurate height measurement following the inclination even for solder printed on steeply warped areas.
Equipped with automatic height reference plane setting function
An automatic height reference plane setting function is provided to obtain a constant and stable height reference plane even when lot differences or substrate color variations occur during production flow.
M2M Solutions
Compatible with Panasonic Corporation's iLNB and FUJI Corporation's Nexim. Automatic setup is available for production model changeover on a line-by-line basis.
Compatible with Panasonic Corporation's APC System. Feedback of print position correction to solder printers and feed-forward of mounting position correction to mounting machines are supported.
Specifications
| PCB size | 50 x 50mm ~ 510 x 460mm |
| PCB thickness | 0.3 ~ 4.0mm |
| Transfer reference | Rear of front (factory setting) |
| Convey direction | Left to right or right to left (factory setting) |
| Transfer height | 900+/-25mm |
| Camera resolution | 18µm / 12µm (factory setting) |
| Lighting | 2D: Whole circumference top/bottom RGB / 3D: Laser optical cutting |
| Inspection data | Automatically converted from Gerber data |
| Power supply voltage | Singl phase AC100V+/-10% 1.5kVA (50/60Hz) |
| Dry air requirement | 0.4~0.5Mpa 10Nl/min |
| External dimensions | W1,100mm x D1,200mm x H1,550mm (excluding signal tower) |
| Weight | Approx. 400kg |
| Option | L=750mm support (with 2 division inspection) 1D/2D code support Statistical analysis software Offline software |
