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Inspection-Equipment

2D X-ray Inspection System (NXI-2DYIMH, NXI-2DY)

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High Speed Inspection

nxi-2dyimh_3NXI-2DYIMH adopts newly developed image capturing-devices; high-sensitivity camera, internal shutter mechanism and high-performance device to improve the inspection takt time up to 20%. The system is best for the increasing in-line non-destructive inspection.

Lower Running Cost

nxi-2dyimh_4NXI-2DYIMH has a high-performance device to reduce the irradiation doze, leading its excellent endurance. This helps to reduce the running cost drastically.

Automatic Inspection Functions

nxi-2dyimh_5The NXI-2DY allows for a variety of inspections. It detects open solder joints as well as bridges and missing solder joints on BGAs/CSPs, with a high degree of accuracy.
In addition, our unique void detection method allows for the detection of voids as small as 25 μm.
Automatic inspections can be carried out after registering positions in the field of view and pass/fail compliance values in advance.

Inspection items (bump inspections for BGAs and CSPs)
Center thickness / average thickness / rate of thickness variation / area / volume / void / foreign matter / missing / bridge / roundness / cross-section ratio / misalignment / misaligned rotation
A wide variety of inspections are available upon request. For details, please contact our sales representatives.

Analysis Functions

nxi-2dyimh_6The NXI-2DY utilizes clear transparent images to implement various monitoring applications with its analysis functions.

Transparent Image analysis
Dimension measurement / wire flow rate measurement / 1D and 2D profiles, etc.
Thickness Measurement Function
By comparing the object with a reference sample having the same composition, the NXI-2DY converts luminance values into thickness information and outputs its data.
Inspection items for solder
Center thickness / average thickness / rate of thickness variation / area / volume / void / foreign matter / missing / bridge / roundness / cross-section ratio / misalignment / misaligned rotation

“Bottom Side Cancel” function

The “Reverse-side Cancel” function works to separate the top side features on the double-sided PCB from the bottom-side feature to help you to extract the portion you wish to inspect.

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Data Control System (Option)

The NXI-2DY allows automatic inspection results to be controlled on a server to carry out a series of follow-up checks, such as feedback of quality information to previous processes.

• Reading of ID information including QR codes and bar codes
• Centralized server control
• Visual checking tools