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Inspection-Equipment

3D X-ray Inspection System (NXI-3300)

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Inspection Algorithm for Various Types of Component

・Lead and chip components as well as BGA and SCP can be automatically inspected
・Solder inspection items corresponding to each component are vailable

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High Speed Automated Inspection

・Requires only approx. 75 sec to inspect entire double-sided PCB (330×250mm)
・Sophisticated sensor, internal shutter and rigid gantry structure
ensure stable inspection quality

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Analysis Function

・Ideal for the trial production and evaluation

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